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DAS OEM · Modular DAS interrogator

Modular DAS core for system integration, OEM and ODM.

DAS Modular Product Technical Datasheet

DAS Modular Product Technical Datasheet

Generation 4, 4.5 and 5 DAS platforms support complete instruments, modules, OEM and ODM delivery. Agreed data interfaces support third-party software, AI algorithms and industry platforms.

DAS OEM · Modular DAS interrogator

Product platforms

GenerationCore technologyLower frequency
Gen 4Coherent multi-pulse interference and fusion0.1 Hz
Gen 4.5Multi-pulse fusion with software polarization diversity0.1 Hz
Gen 5Three bands and X/Y optical diversity; six-branch complex-vector fusion0.01 Hz (by configuration)

Modular interrogator specifications

ParameterSpecification
Applicable Products4th, 4.5th and 5th generation DAS platforms support modular, OEM and ODM delivery
Product & OpennessRefer to the corresponding product specification for sensing performance; OEM/ODM, data/protocol access and secondary development are supported
Fiber TypeSingle-mode fiber 9 μm/125 μm; core count, jacket dimensions and materials are configured for the application
Operating VoltageDC 24 V; average power consumption approx. 10 W (varies with distance and channel configuration)
Communication Interface1 × RJ45 Gigabit Ethernet for communication with AI training or third-party platforms
Protocol SupportCustom phase/data transmission protocol; access scope is defined by the cooperation project
Optical ConnectorE2000 self-locking dustproof connector; FC/APC optional
Laser Safety ClassClass 1
Operating Temperature-10 °C ~ +50 °C
Storage Temperature-20 °C ~ +70 °C
Dimensions (W × D × H)234 × 260 × 52.2 mm
Weight7 kg

Range, bandwidth, spacing, physical channels and algorithms follow the selected generation/model. Approximately 10 W applies to the relevant module configuration, not all long-range or multichannel variants.

System integration and delivery

ModeDeliverables and use
Complete instrumentDAS instrument and software for end-user projects
ModulesOptical, acquisition and processing modules for integration into customer enclosures
OEMAdaptation of enclosure, markings, interfaces and configuration
ODMProject-specific mechanical, interface, functional and software design
Software integrationAgreed data and phase protocols for AI and third-party platforms
Application integrationCombined configuration of sensing cable, DAS, AI and application platforms

Signal path: sensing fiber → DAS core module → Gigabit Ethernet and data protocol → server/edge computing → application platform. Standard single-mode fiber is used; configure peripherals, cable and protocols for the project.

Agree interface access, version management, integration drawings, software functions and support in the supply configuration. Validate third-party software and algorithms in the integrated system.

Frequency range depends on fiber length, scan rate, gauge length and SNR. The 100 kHz upper limit applies only to short-range configurations with adequate high-speed sampling, not simultaneously across a 30–100 km fiber. Conventional per-point temporal sampling must satisfy the Nyquist criterion with anti-aliasing margin.

Applications and further reading

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